Surface Mount Assembly

Surface Mount Assembly has become our mainstay of business at BW Electronics utilising our modern and state-of-the-art Surface Mount Process. A great deal of products quoted on these days are surface mount, but still very often found with the combination with conventional through hole components.

On completion of the assembly stage, the boards then pass through our AOI / Inspection phase.

Prototype, Low or Medium Volume Assembly

* Hand or Semi Auto vision screen printers.
* Tecan Genesis frame system
* Accuracy and repeatability on fine pitch devices

* Hand & Semi Auto placement for Prototypes
* TWS Quadra Laser Auto placement machines
* Placement accuracy +/- 0.10mm on X/Y axis & 0.16 degrees on theta
axis
* Places 0402, melf, mini melf, sotdiodes, PLCC & LCCC integrated
circuits up to 35mm. * Electrolytics up to 10.5mm high.
* High feeder capacity - 120 x 8mm feeders
* Max standard board size - 440mm x 360mm
* Productivity - 3600cph

REACH Statement

RoHS Statement

BS EN ISO 9001-2000

High Volume Assembly

* Semi Auto vision screen printers
* Tecan Genesis frame system
* Accuracy and repeatability on fine pitch devices

* i-Pulse M4e Fast Precision Auto placement machines
- Placement accuracy - 60um chips & 35um QFP etc.
- Places 0201 to 54mm sq., QFP, BGA & CSP
- High feeder capacity - 120 x 8mm Feeders
- Max standard board size - 460mm x 410mm
- Belt-less drive in X, Y & Z Axis
- 15mm standard component height
- True on the fly scanning
- Full & automatic MIS system
- Productivity:
- tact speed 0603-12500cph
- tact speed SOIC16-11500cph
- tact speed QFP 100-3700cph